Double sided Metal Core Copper Base MC PCB printed circuit boards
Oneseine PCB information:
PCB material:metal core copper base
Layer:2
Copper weight:6OZ
Solder mask:Blue
Outline: Routing, punching, V-Cut
Soldermask: White/Black/Blue/Green/Red Oil
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Packing: Vacuum/Plastic bag
Samples L/T: 5~7 Days
MP L/T: 6~8 Days
Copper Core PCB
Copper core PCB is a copper substrate + Insulated layer + copper
circuits layer PCB,also, it is called copper substrate pcb, copper
based pcb,copper clad pcb.
As a MCPCB manufacturer,oneseine made various Copper core PCB for customers,
Which used for High Power LED lighter ( 1000W+ ) and power supply.
In LED field,there are 4 types of Copper based Circuit Board.
1. General Copper substrate Board.
2. COB Copper PCB(Chip on Board copper PCB)
LED chip Direct thermal sink to copper substrate.
3. Direct thermal path,no dielectric layer under the thermal path pad.
4.Direct thermal path,no dielectric layer,Aluminum-copper pcb.
Generally speaking, aluminum is the most economic option considering thermal conductivity, rigidness, and cost. Therefore, the base/core material of normal Metal Core PCB are made of aluminum. In Oneseine, if not special request, or notes, the metal core refer will be aluminum, then MCPCB will means Aluminum Core PCB. If you need Copper Core PCB, Steel Core PCB, or Stainless steel core PCB, you should add special notes in drawing.
Sometimes people will use abbreviation “MCPCB”, instead of the full name as Metal Core PCB, or Metal Core Printed Circuit Board. And also used different word refers the core/base, so you will also see different name of Metal Core PCB, such as Metal PCB, Metal Base PCB, Metal Backed PCB, Metal Clad PCB and Metal Core Board and so on.
MCPCBs are used instead of traditional FR4 or CEM3 PCBs because of the ability to efficiently dissipate heat away from the components. This is achieved by using a Thermally Conductive Dielectric Layer.
According to different location of metal core and trace layers of PCB, right now, we divide into five basic types:
Single Layer MCPCB(only one trace layer one one side);
COB MCPCB (chip-on-board MCPCB, one trace layers);
Double Layers MCPCB (two trace layers on the same side;
Double Sided MCPCB (two trace layers on each side);
Multi Layers MCPCB (More than 2 trace layers per board);
Metal Core PCBs 2030: Quantum Thermal Management & Self-Optimizing Systems
Transformative Material Architectures
Plasmonic Metasurfaces:
Gold nanorod arrays embedded in dielectrics convert heat into directional IR radiation (85% emissivity), eliminating heatsinks in 5G mmWave arrays.
Topological Insulator Laminates:
Bismuth selenide (Bi₂Se₃) interlayers block phonon backscattering, achieving *k* = 550 W/mK at 20μm thickness (Nature Mater. 2024).
Programmable Phase-Change Cores:
VO₂-coated aluminum cores dynamically switch thermal conductivity from 5→120 W/mK at 68°C for adaptive thermal throttling.
Autonomous Manufacturing Revolution
Generative AI Co-Design:
LLMs translate natural language specs ("Optimize for 200W EV charger, 105°C ambient") into validated stackups in <12 minutes.
Diffusion models synthesize novel dielectric composites exceeding theoretical *k*-values.
Self-Correcting Production Lines:
In-situ SEM monitors dielectric crystallization during lamination, triggering laser annealing to prevent voids.
Quantum dot sensors map thermal gradients in real-time, auto-adjusting copper distribution.
Digital Twin Certification:
Every PCB ships with NFT-based thermal/structural simulation history validated on blockchain.
Thermodynamics Redefined
Negative Thermal Expansion (NTE) Alloys:
ZrW₂O₈ cores shrink when heated (CTE = -9 ppm/°C), countering FR4 expansion.
Phonon Engineering:
Graphene nanomesh interconnects route heat along prescribed paths via phononic bandgap tuning.
Entropy-Balanced Stacks:
Machine learning optimizes layer sequences to minimize thermal resistance (θ<0.1°C/W) while maximizing EMI shielding (80dB).
Circular Economy Integration
Blockchain Material Passports:
Track copper/aluminum recovery rates exceeding 99.2% via solventless delamination.
Self-Healing Dielectrics:
Microcapsules release thermally conductive polymers (k=3.2 W/mK) upon crack detection.
CO₂-Negative Production:
Carbon sequestration binders store 8kg CO₂ per m² PCB manufactured.
Industry 4.0 Certification
Autonomous Compliance: AI auditors continuously verify IPC-2591/ISO 14064 standards.
Predictive Reliability: Neural nets forecast 20-year failure probabilities within ±2% error.
*"Our quantum-dot enhanced aluminum cores reduced satellite power module temperatures by 48°C while cutting mass by 300g—something physically impossible with classical materials."*
– CTO, LEO Satellite Constellation Startup
